1. .1 An IC size is
(A) Very large
(B) Large
(C) None of the above
(D) Extremely small
2. .2 ICs are generally made up of
(A) Germanium
(B) Silicon
(C) Copper
(D) None of the above
3. .3 The most commonly used ICs are
(A) Monolithic
(B) Thin films
(C) Hybrid
(D) None of the above
4. .4 Cannot be fabricated on an IC
(A) Transistors
(B) Diodes
(C) Transformers
(D) Resistors
5. .5 An audio amplifier is an example of
(A) Digital IC
(B) Both digital and linear IC
(C) Linear IC
(D) None of the above
6. .6 The active components in an IC are
(A) Resistors
(B) Transistors and diodes
(C) Capacitors
(D) None of the above
7. .7 ICs used in computers are
(A) None of the above
(B) Linear
(C) Both digital and linear
(D) Digital
8. .8 The SiO2 layer in an IC acts as
(A) A resistor
(B) An insulating layer
(C) Mechanical output
(D) None of the above
9. .9 ICs are used in
(A) Linear devices only
(B) Both linear and digital devices
(C) Digital devices only
(D) None of the above
10. .10 When you move counter-clockwise around the chip the pin numbering starts from
(A) Bottom left
(B) Top left
(C) Bottom right
(D) Top right
11. .11 Digital ICs process
(A) Digital signals only
(B) Linear signals only
(C) Both digital and linear signals
(D) None of the above
12. .12 Which of the following is most difficult to fabricate in an IC?
(A) Diode
(B) Transistor
(C) Capacitor
(D) FET
13. .13 Small Scale Integration has components per chip up to
(A) 50
(B) 500
(C) 100
(D) 1000
14. .14 Medium Scale Integration has components per chip up to
(A) 1000
(B) 2000
(C) 3000
(D) 4000
15. .15 Large Scale Integration has components per chip up to
(A) 400000
(B) 200000
(C) 300000
(D) 100000
16. .16 A process of controlled growth of a crystalline doped silicon on a single crystal substrate.
(A) Etching
(B) Epitaxy
(C) Metallization
(D) Oxidation
17. .17 A glass plate with desired pattern for diffusion is called
(A) Bonding
(B) Diffusion
(C) Mask
(D) None of these
18. .18 A process of selective removal of regions of a semiconductor, metal or SiO2.
(A) Epitaxy
(B) Metallization
(C) Oxidation
(D) Etching
19. .19 A thin disk of semiconductor in which number of ICs are fabricated simultaneously is called
(A) Chip
(B) Wafer
(C) P-Substrate
(D) None of these
20. .20 A process that provides interconnections between components.
(A) Metallization
(B) Bonding
(C) Etching
(D) Scribing
21. .22 Operational amplifiers are
(A) Linear ICs
(B) Digital ICs
(C) Both linear and digital ICs
(D) None of the above
22. .23 A differential amplifier
(A) Is a part of an Op-amp
(B) Has two inputs
(C) Both a & b
(D) Has two outputs and one input
23. .24 With zero volts on both inputs, an OP-amp ideally should have an output
(A) Equal to CMRR
(B) Equal to zero
(C) Equal to the positive supply voltage
(D) Equal to the negative supply voltage
24. .25 Of the values listed, the most realistic value for open-loop voltage gain of an OP-amp is
(A) 100,000
(B) 2000
(C) 80db
(D) 1
25. .26 The Op-amp can amplify
(A) A.C. signals only
(B) D.C. signals only
(C) Neither D.C. nor A.C. signals
(D) Both A.C. and D.C. signals
26. .27 The input stage of an Op-amp is usually a
(A) None of the above
(B) Class B push-pull amplifier
(C) CE amplifier
(D) Differential amplifier
27. .28 Current cannot flow to ground through
(A) A virtual ground
(B) An A.C. ground
(C) A mechanical ground
(D) An ordinary ground
28. .29 The output stage of an Op-amp is usually a
(A) Differential amplifier
(B) CE amplifier
(C) Class B push-pull amp
(D) Swamped amplifier
29. .30 A voltage-follower
(A) Has a gain of 1
(B) All of these
(C) Has no feedback resistor
(D) Is non-inverting